用于芯片封裝完后的FT測試，可實現手動自動切換，可兼容各種封裝類型的芯片，客制化程度高，能滿足各種測試需求
Used to FT test after chip packaging, it can realize manual and automatic switching. It is compatible with chips of various packaging types, has a high degree of customization, and can meet various test requirements
pitch 范圍：最小 0.3mm
電流范圍：2A 以內持續電流
接觸阻抗：50~100mΩ
溫度范圍：室溫
Pitch range: minimum 0.3mm
Current range: continuous current within 2A
Contact impedance: 50 ~ 100 mω
Temperature range: room temperature
