用于產品研發階段及FAE分析使用，可兼容各種封裝類型的芯片及通訊模塊產品，具有成熟的設計方案，能實現快速研發生產。
It can be used in product development and FAE analysis. It can be compatible with various types of chip and communication module products. It has mature design scheme and can realize rapid R & D and production.
pitch 范圍：最小 0.3mm
電流范圍：3A 持續電流
接觸阻抗：50~100mΩ
溫度范圍：室溫
Pitch range: minimum 0.3mm
Current range: 3A continuous current
Contact impedance: 50 ~ 100 mω
Temperature range: room temperature
